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The core element in MEMS generally consists of two principal components, namely, a sensing or actuating element and a signal transduction unit [6] Figure 86 illustrates the relationship between the components in a microsensor, microactuator and a microsystem A sensor is defined as a device that perceives useful information from a surrounding environment and provides one or more output variables to a measuring instrument On the other hand, an actuator is a device that creates a force to manipulate itself, other mechanical devices or the surrounding environment to perform some useful functions [2] Microsensors are built to detect thermal, mechanical, chemical, magnetic, radiant or electrical signals [4] The advantages of microsensors are that they are accurate when a minimal amount of the required sample substance is used On the other hand, microactuators function using the electrostatic principle, thermal forces and piezoelectric crystals Presently, microsystems consist of a microsensor, an actuator and a processing unit Microsystems have put forward the idea of systems-on-a-chip MEMS is an enabling technology which allows the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications Microelectronic integrated circuits can be thought of as being the brain of a system, and MEMS augments this decision-making capability by lending it eyes and arms, to allow microsystems to sense and control the environment Sensors gather information from the environment through measuring mechanical, thermal, biological, chemical, optical, and magnetic phenomena The electronics then process the information derived from the sensors and through some decision-making capability direct the actuators to respond by moving, positioning, regulating, pumping and filtering, thereby controlling the environment for getting some desired outcome or purpose [7] Microelectromechanical systems (MEMS) can also be classified into passive electro/mechanical transducers and active electro/mechanical feedback to transducers Figure 87 shows a passive system in which the gain or the bandwidth is controlled by a preamplifier dynamic range There is no active transducer calibration, testing and control On the other hand, the active system in Figure 88 utilizes a front end gain or bandwidth control, and requires electromechanical system calibration, testing and control [8].

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Active low-chip select input Serial clock input. Clocks data in and out of the ADC. In the external clock mode, the duty cycle must be 45% to 55%. Serial data input. Data is clocked at the rising edge of SCLK. Three-level shutdown input. A low input puts the ADC in low-power mode and conversions are stopped. A high input puts the reference buffer amplifier in internal compensation mode. A floating input puts it in external compensation mode. Analog inputs. Analog ground and input for single-ended conversions. Serial data output. Data is clocked out at the falling edge of SCLK. Serial strobe output. In external clock mode, it pulses high for one clock period before the MSB decision. Digital ground. Positive supply voltage. Negative supply voltage. 5 volts 5%. 5 volts 5% or AGND.

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During manufacture of a thermocouple assembly, the usual practice is to twist the thermocouple wires together prior to welding Upon welding, the twisted material will fuse and melt back After welding, it may be necessary to untwist the pair just behind the bead Of course, this is risky because many of the thermocouple materials are brittle before welding and are even more so afterward 4731023 Most Common Couple The most common thermocouple used for PWB soldering application is the K type, Ni-Cr/Ni-Al (chromel-alumel) couple, as it possesses a.

FIGURE 47.11 Arrows indicate impinging forced-convection flows from oven blowers. The inadvertent thermocouple junction (crossed wires) will record oven local air temperature rather than the intended measurement target the solder-joint area.

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thermal measurement range best suited for soldering of circuit boards regardless of alloy type. There are two main devices in use for measuring the output of the thermocouple: the reflow tracker and digital thermometer. 47.3.8.2.4 Measurement Instrumentation. One of the two most primitive measurement devices is the electronic (digital) thermometer with output hand-recorded or tied to a chart recorder. The other (though much more sophisticated) device is the reflow profiler or tracker, an electronic package that can not only output the time-temperature plot of multiple thermocouples but can also make certain assessments of the data, such as heating ramp rate, preheat time, time above liquidus, cooling ramp rate, and other attributes. Tracker systems are computer-based and battery-powered and can generate detailed reports and graphs of a reflow cycle. Most are sold with a thermal protective cover that enables them to travel through the oven, thus eliminating the resistive losses and thermal heat-sinking effects of excessively long thermocouple wires. Some even output temperature by wireless transmitter so that measurement data can be observed in real time. Once a selected above-ambient threshold temperature has been reached, such as 30 C, the tracker begins recording the experienced thermal environment per unit time. It samples and

records the circuit board s thermocouples at short, programmable time intervals (several times per second) for the entire trip through the oven s tunnel When the tracker emerges from the exit end of the oven s tunnel, it is removed from its protective thermal barrier and docked to a computerThe data stored in the electronic tracker are uploaded to the computer, conditioned, displayed, reported, and printed for analysis The user defines the reporting format, including the type of data sought, thermocouple plots, and other relevant, run-related data Some systems are capable of making predictive corrections to the profile based on current measured conditions and recorded oven settings This can further enhance the ease of adjusting a complex multizoned reflow oven to meet the requirements of a particular job.

Microelectro-mechanical Systems (MEMS)

Whether a simple or complex model is selected, the reflow tracker is invaluable for setting up the oven and checking process repeatability When an electronic tracker is used, its presence in the oven may have an impact on the resulting profile data by affecting the local aerodynamics within the oven The trackers also have thermal mass, but all trackers are sold with an insulating cover to protect their electronics It is best to check the influence of the tracker s presence as it traverses through the oven tunnel To do this, use long thermocouple wires and, once the oven has warmed to a steady-state operating condition, run the profile tracker with the tracker a fixed distance behind the profile board Note that the tracker is usually placed to follow the board in reflow.

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