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Were the tracker to precede the thermocoupled profile board, it might cause the heaters to ramp up as the oven attempts to compensate for the thermal mass of the tracker or compensate from the disrupted or deflected air flow Although that is what happens during a reflow cycle as a cooler board enters a heated zone of the oven, the oven would attempt to adjust for the board s thermal mass The added thermal mass or disruption of the air flows from the profile tracker would not be a factor in the normal reflow process Rather than assessing the reflow tracker effect on the profile, if you maintain the tracker one board length away from the instrumented board, you can eliminate the likelihood of the tracker having any influence on the measured profile 473103 The Profile Board The profile board is the keystone for any soldering process.

It is a board loaded with its complement of appropriate components Thermocouples are attached to critical locations to ensure that proper soldering temperatures are reached during the bonding cycle Typically thermocouples are embedded under BGAs (innermost joint and outermost joint) and on fine-pitch and even some passive components The idea is to ensure that the most difficult, thermally challenging parts are receiving enough heat and that the lightest components are not overheating at the same time Sometimes it is impossible to achieve the perfect balance, and in such cases the thermal edge is given to the area array components to ensure good soldering beneath while slightly overheating the lighter components It is good practice to attach thermocouples to components on the leading edge of the board, the trailing edge of the board, the sides, and the middle.

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Input to the reference buffer amplifier. Reference voltage for AD conversion. Also output of the reference buffer amplifier ( 4.096 volts). Also, input for an external precision reference voltage source.

It may take more than one trip through the oven to collect data for all these locations There is no substitute for a profile board Some have tried weighing the board for an estimate of thermal mass Generic profiles with overly hot peak temperatures have been applied and other supposed short-cuts have been attempted None of these approaches can be 100 percent successful There is no replacement for preparation and proper thermal assessment with a profile board Typically for oven reflow soldering, one profile board is prepared for the secondary-side reflow profile (in which only secondary-side components are mounted), then another for primary-side reflow profile (in which both secondary- and primary-side components are mounted) Another board is prepared for wave soldering (all SMDs loaded plus PTH parts) These boards also double as rework profile boards.

It is wise to attach thermocouples to power and ground pins if that information is readily available These connection points are the most thermally challenging points for a particular device This is especially true on thick motherboards where there may be multiply interconnected, thick ground, or power planes embedded within the board, which are slow to heat and slow to cool..

Fig 86: The functional relationship of a microsensor, microactuator and a microsystem [6]

Always allow the profile board and the reflow profile tracking instrument to cool to room temperature before attempting another profile check. Cooling with a fan greatly decreases the wait time. 47.3.10.3.1 Thermocouple Deployment. The size and position of the thermocouple are critical for accurate and reliable thermometry. There are many methods for securing the thermocouple bead to the PWB and some simple rules for proper thermocouple use:

The junction must be in contact with the object to be measured. Each of the thermocouple legs must be kept at the same temperature. There should be only one junction (the bead) between the two legs of the thermocouple. The measuring technique must not interfere with the outcome of the measurement.

47.3.10.3.2 Thermocouple Contact. The thermocouple bead must be in intimate contact with the lead and pad combination of the solder joint to be measured. Therefore, the thermocouple bead must be inserted between the device lead and the circuit board bonding pad. It is good practice to tailor the size of the thermocouple wire and, thus, the bead, for the scale of the solder joint to be measured. Flattening the thermocouple bead also helps in positioning it between lead and pad. Flattening can be accomplished with smooth-jaw pliers, a smooth-jaw vise, or a hammer.After flattening the bead, check to ensure that it is neither cracked nor broken (see Fig. 47.12).

FIGURE 47.12 Checking the quality of the termocoupling: (a) A good thermocouple deployment. The bead is secured beneath a single lead and held in place with hightemperature solder. (b) The thermocouple is held in place by high-temperature solder but the solder has bridged to multiple leads. Temperature indicated will be that of the entire thermal mass of leads and solder rather than a single lead as in (a).

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