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To clock the control byte into the ADC, the CS* pin is pulled low and a rising edge on SCLK clocks a bit into Din. The control byte format requires that the first bit to be shifted in should be 1 . This defines the beginning of the control byte. Until this start bit is clocked in, any number of 0 can be clocked in by the SCLK signal without any effect. The control byte must be 1XXXXXX11 (binary). Xs denote the bits required for channel and conversion mode selection. The two least-significant bits are set to 1 and 1 to select the external clock mode option. Figure 6.17 illustrates the control byte format. The control byte value for starting a conversion on channel 0 of the ADC, in unipolar, single-ended conversion mode using external clock, is 10001111 (binary) or 8F hex. Let s now consider the timing diagram in Figure 6.18, which illustrates the conversion and readout process on ADC channel 0. The timing diagram illustrates five traces, namely CS*, the chip select signal; SCLK, the serial clock required for programming the ADC and the subsequent readout; the Din, which carries the programming information (the control byte); the SSTRB, which the ADC generates to indicate the beginning of the readout process; and Dout, the actual data output from the ADC, which is the conversion result. The data on signal Din is clocked into the ADC at the rising edge of the SCLK signal.

Fig 87: A passive electro/mechanical transducer [8]

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For BGAs and other area-array devices, it is necessary to drill a very small diameter hole through the board and into the BGA ball or column. This procedure is done with a very fine drill bit slightly larger than the BGA ball.The drill bit should be kept short (slightly longer than the board plus ball thickness) to avoid breaking the bit. It helps to drill the hole location before assembly and then redrill to remove solder for thermocouple insertion after reflow. An overly hot thermal profile can be used for assembly of the thermal profile board. Drilling into the ball at that time completes the path for thermocouple insertion. As long as the hole diameter is kept small, there is no need to add solder to retain the thermocouple within the BGA. If the hole is kept slightly larger than the thermocouple bead, the radiated air temperature within the hole and around the thermocouple bead should be the same as the ball temperature. A hightemperature adhesive or heat-resistant tape should be used to anchor thermocouple leads to

FIGURE 47.13 Thermocouple embedded into BGA ball. Leads are anchored to the board with a high-temperature adhesive or high-temperature tape.

the board to keep them in place and to prevent dislodging of the bead from its intended measurement target (see Fig. 47.13). Note that there is no need to seal the drilled hole into which thermocouple is inserted. It is a miniature blind hole largely filled with thermocouple wires.Air transfer within this hole will be negligible. 47.3.10.3.3 Thermocouple Size. Many factors can confound the solder-joint temperature measurement process, regardless of whether the thermocouple bead is properly deployed between lead and pad. Among these are the size of the bead and the thermal mass of the thermocouple assembly. In general, the use of finer-gauge thermocouples such as 30 to 36 American Wire Gauge (AWG) (see Table 47.1) is recommended. This will permit insertion between lead and pad even at very fine lead and pad pitches. Ideally the thermocouple bead will be completely within the solder joint to be measured.

TABLE 47.1 AWG versus Wire Diameter and Anticipated Thermocouple Bead Diameter Wire diameter (in.) 0.032 0.020 0.010 0.005 Wire diameter (mm) 0.81 0.51 0.25 0.127 Bead diameter (in.) 0.048 0.030 0.015 0.0075 Bead diameter (mm) 1.22 0.76 0.38 0.19

Most of the designing process for producing MEMS devices is done with the aid of a Finite Element Analysis (FEA) software For instance, Lucas Novasensor uses Ansys which is an FEA program developed by Swanson Analysis System Inc for structural analysis of micron-sized sensors and valves [9] In addition, a software that simulates the micromachining process is also available The design and the manufacture of microelectromechanical systems involves various scientific and engineering disciplines as illustrated in Figure 89

Strive for the shortest possible length of thermocouple wire pair that is practical for the application. Long, large diameter wire may conduct heat away from the solder joint to be measured, altering its true heating nature. 47.3.10.3.4 Securing Thermocouples: Thermally Conductive Adhesives. If an adhesive is to be used to hold a thermocouple bead, its thermal conductivity must be taken into account. Most thermally conductive adhesives are not nearly as conductive as metal or solder. The best are filled with high thermal conductivity materials such as aluminum, boron nitride, or other

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